基于Hopfield网络的硅镜异形盲孔超声加工路径规划*

作者：张云电，胡皇印，林金钳，余芳 日期：2008-02-25/span> 浏览：3137 查看PDF文档

基于Hopfield网络的硅镜异形盲孔超声加工路径规划*

张云电，胡皇印，林金钳，余芳
（杭州电子科技大学 机电工程学院,浙江 杭州 310018）

摘要：单晶硅材料以其优异的物理性能成为了新型轻质反射镜材料，而且设计人员要求在硅晶体端面形成大量异形盲孔。但是，采用传统加工方法很难保证其完整性、加工效率和质量。针对设计、生产的实际情况，研究了超声加工机理，提出了基于Hopfield网络的硅镜超声加工路径规划方案，并给出了规划路径。研究结果表明，该方案为生产实践提供了理论依据，具有广阔的推广应用前景。
关键词：超声加工；Hopfield网络；路径规划
中图分类号：TP183；TG663文献标识码：A文章编号：1001-4551(2008)02-0015-03

Siliconreflector abnormity blind holes ultrasonic machining path programming based on Hopfield network
ZHANG Yundian, HU Huangyin, LIN Jinqian, YU Fang
(College of Mechanical & Electrical Engineering, Hangzhou Dianzi University, Hangzhou 310018, China)
Abstract: Single crystal silicon material has outstanding physical performance and has become new type light reflector material. Designers desire to mechanize abnormal blind holes on the end surface of silicon crystal. However, it is hard to assure the integrality of the silicon crystal as well as the machining efficiency by using traditional machining method, and the quality is poor. According to the practical situation, the ultrasonic machining mechanism was studied, planning method for ultrasonic machining path of siliconreflector based on Hopfield network was presented, and planning path was given. The research results show that the plan provides the theoretical basis for the performance of the project, and it illustrates a good prospect of application and extension.
Key words: ultrasonic machining; Hopfield network; path planning
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