集成电路版图中的多边形匹配比较研究

作者：史峥,高晓莹，任杰，施怡雯 日期：2007-10-25/span> 浏览：3558 查看PDF文档

集成电路版图中的多边形匹配比较研究

史峥,高晓莹，任杰，施怡雯
(浙江大学 超大规模集成电路设计研究所，浙江 杭州 310027)

摘要：光学邻近校正是最重要的分辨率增强技术，而对光学邻近校正后的版图修正逐渐成为提高集成电路版图质量的必需步骤。提出了一种用于postOPC版图（做过OPC的版图）修正的多边形匹配比较的线性算法。算法通过比较preOPC和postOPC的版图，提取OPC校正时的分段信息和段偏移量，使得postOPC版图的修正能够充分利用前次OPC的结果，避免了重做OPC，提高了OPC验证后修正的效率。
关键词：可制造性设计；光学邻近校正;分辨率增强技术;多边形匹配比较
中图分类号：TN305文献标识码：A文章编号：1001-4551(2007)10-0032-04

Design of polygon matching and comparison in IC layout
SHI Zheng, GAO Xiaoying, REN Jie, SHI Yiwen
(Institute of VLSI Design, Zhejiang University, Hangzhou 310027, China)
Abstract: Optical proximity correction (OPC) is the most important RET and postOPC fixing technique has become a necessary process to improve the OPC quality. A liner polygon matching and comparison algorithm for postOPC fixing technique were presented. By comparing the preOPC and postOPC layout, it recognized and recorded the fragmentation and offset information. Therefore the postOPC fixing process can reuse the previous OPC result. By avoiding redoing OPC allover again, the entire processing efficiency was highly improved.
Key words: design for manufacturability (DFM); optical proximity correction (OPC); resolution enhancement technique (RET); polygon matching and comparison

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